HYNCC TOPSHEET _ KAMISOFT Advanced
HYNCC TOPSHEET - KAMISOFT® Advanced

KAMISOFT® Advanced Spunmelt Fabrics


Kamisoft® Advanced provides even greater softness with the premium appearance of Kamisoft® by utilizing Chemistry to improve softness Attributes

Circular Solutions:

Recycled plastic

Features & Benefits:

  • Soft calender Spunbond and Spunmelt Fabrics
  • Broad range of basis weights from 8 - 65 gsm
  • Product Attributes improve Convertability
  • Available for lamination with backsheet films
  • Visual attractiveness
  • Excellent breathability and high barrier performance

Regions Available

  • Global

Ideal For:

Hygiene and Healthcare Articles requiring Softness including Diapers, Wipes, Pants, Gowns, Coveralls etc.

Related Products

Related Capabilities

2 Categories

Lamination

The lamination process combines multiple layers so that the composite material achieves improved strength, stability, insulation, appearance, or other properties from the use of the different substrates. Berry Global offers capabilities with extrusion, adhesive and ultrasonic lamination.

Non-Woven Manufacturing

Berry Global manufacturers a long list of non-woven fabrics that serve both single-use disposable needs and very durable fabric requirements. Learn more about our global capabilities to serve unique non-woven needs.

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If you'd prefer to call us: +1 (877) 662-3779
Contact information for our global facilities can be found via our locations page.

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